product specification date: 11/27/2006 no. 61l70028 cosmo electronics corporation h.p led : KLE00WWX1 sheet 1 of 6 rev. 1 1. features cosmo?s high power led packages can handle up to 350-500ma dc current,. these packages are formed by bonding 1 pcs led chip on a 8mm emitter. the main features of these packages are as follows j very high flux output per led. very long operation life time up to 100k hours attainable, by using a proper heat sink. 120 10 o cool beam in most packages. 2. applications outdoor and indoor architectural lighting reading light (car/bus/aircraft) decorative/entertainment lighting bollards/security/garden lighting traffic signal portable lighting (flashlight/bicycle) edge-lit signs (exit sign/point of sales) lcd backlights light guide 3. operation and storage temperature parameter symbol value unit operation temperature topr (data to be ready, -30~+85) o c storage temperature tstg (data to be ready, -40~+110) o c
product specification date: 11/27/2006 no. 61l70028 cosmo electronics corporation h.p led : KLE00WWX1 sheet 2 of 6 rev. 1 4. dimensions 5. electrical & optical characteristics led at 350ma (1 chip / w) , ta = 25 o c forward voltage (vf) luminous flux (lm) part number cct (k) typ. max min typ. wattage max. (w) view angle ( 2 1 2 ) wwx1 2500~3500 3.6 4 30 40 1.4 120 10 o 3 1 2 1 3 4 unit = mm ; tolerances ? 04
product specification date: 11/27/2006 no. 61l70028 cosmo electronics corporation h.p led : KLE00WWX1 sheet 3 of 6 rev. 1 6. wavelength characteristics relative spectral power intensity of white vs. wavelength (ta=25 o c ) 0 20 40 60 80 100 400 450 500 550 600 650 700 750 wavelength (nm) relative intensity (%) 7. light output characteristics relative light output vs. junction temperature 5p junction temperature vs. relative luminous flux 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 junction temperature ta[ o c] relative luminous flux [a.u]
product specification date: 11/27/2006 no. 61l70028 cosmo electronics corporation h.p led : KLE00WWX1 sheet 4 of 6 rev. 1 8. spatial radiation pattern forward current vs. relative luminous flux (ta=25 o c ) forward current vs.relative luminous flux 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 200 400 600 800 1000 forward current i f (ma) relative luminous flux [a.u.] forward voltage vs. forward current (1 led/pcb, ta=25 o c ) forward voltage vs. forward current [1 chip] 1 10 100 1000 10000 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 forward voltage v f (v) forward current i f (ma)
product specification date: 11/27/2006 no. 61l70028 cosmo electronics corporation h.p led : KLE00WWX1 sheet 5 of 6 rev. 1 forward voltage vs. ambient temperature (1 led/pcb, i f =350ma) ambient temperature vs. forward voltage 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 -40 -20 0 20 40 60 80 100 5q5? 5?5? 5?5?55p5?5?5? 5?5?55?5555?5p5?5?5? 5p 5? 5s 5? forward voltage vf (v) 9. spatial radiation pattern warm white
product specification date: 11/27/2006 no. 61l70028 cosmo electronics corporation h.p led : KLE00WWX1 sheet 6 of 6 rev. 1 10. reliability test stress test stress conditions stress duration failure criteria failure rate 1.high temperature operation life 85 o c at 350ma 1,000 hrs 0/12 2.room temperature operation life 25 o c at 350 ma 1,000 hrs 0/12 3. low temperature operation life -40 o c at 350 ma 1,000 hrs 0/12 4. wet high temperature operation life 85 o c / 60% rh at 350 ma 1,000 hrs 0/12 5.powered temperature cycle (1.)-45 o c /18min at 350 ma (2.)transform /42min (3.)85 o c /18min at 350 ma 200 cycles 0/12 6.temperature cycle (1.)-45 o c /30 min (2.)25 o c /5 min (3.)120 o c /30 min (4.)25 o c /5 min 200 cycles 0/12 7.high temperature storage 110 o c 1,000 hrs 0/12 8. low temperature storage -40 o c 1,000 hrs 0/12 9.high temperature humidity storage 60 o c / 90% rh 1,000 hrs 0/12 10.thermal shock (1.)-40 o c /20min (2.)transform /20sec (3.)110 o c /20min 200 cycles (1)i v< 50% degradation (2)v f max =110% initial 0/12
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